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TO-247-4L-TC
SiC SMT Topside Cooled Package
EVERLIGHT is pleased to launch its first Topside Cooled Package for SiC Power MOSFET. Beside less assembly efforts, main benefits are the maximized Power Density and Heat Dissipation comparing to standard THT TO-247-4L packages.The missing mounting hole allows to increase heatsink contact area about 20%, several versions from 650V to 1700V allowing to meet most requirements for charger or power supply application.
Features:
- Taiwan based Chip-Design, Wafer-Fab and Packaging.
- Reduced system costs because of Surface Mount Technology SMT
- Silicon Carbide Technology
- ~ 20% increased thermal conductivity
- Wide VDS Range of 650 – 1700V
- Pb-Free, Halogeen Free, RoHS compliant
- AECQ certified and Green Fab
Available Versions:
| VDS | 650V | 750V | 1200V | 1200V | 1200V | 1200V | 1200V | 1700V |
| RDSON | 30mΩ | 20mΩ | 14mΩ | 20mΩ | 40mΩ | 60mΩ | 80mΩ | 1000mΩ |
